Open Access
ARTICLE
Pagnchakneat C. Ouk1, Wooguil Pak2,*
1 Department of Computer Engineering, Keimyung University, Daegu, 42601, Korea
2 Department of Information and Communication Engineering, Yeungnam University, Gyeongsan, Gyeongbuk, 38541, Korea
* Corresponding Author: Wooguil Pak. Email:
Computers, Materials & Continua 2022, 70(2), 3099-3116. https://doi.org/10.32604/cmc.2022.020202
Received 14 May 2021; Accepted 30 June 2021; Issue published 27 September 2021
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