Open Access
ARTICLE
P. Thamizhazhagan1,*, M. Sujatha2, S. Umadevi3, K. Priyadarshini4, Velmurugan Subbiah Parvathy5, Irina V. Pustokhina6, Denis A. Pustokhin7
1 Department of Electrical and Electronics Engineering, University College of Engineering, Panruti, 607106, India
2 Department of Electronics and Communication Engineering, Koneru Lakshmaiah Education Foundation, Vijayawada, 522502, India
3 Centre for Nanoelectronics and VLSI Design, SENSE, VIT University, Chennai Campus, Chennai, 600127, India
4 Department of Electronics and Communication Engineering, K. Ramakrishnan College of Engineering, Tiruchirappalli, 621112, India
5 Department of Electronics and Communication Engineering, Kalasalingam Academy of Research and Education, Krishnankoil, 626126, India
6 Department of Entrepreneurship and Logistics, Plekhanov Russian University of Economics, Moscow, 117997, Russia
7 Department of Logistics, State University of Management, Moscow, 109542, Russia
* Corresponding Author: P. Thamizhazhagan. Email:
Computers, Materials & Continua 2022, 70(2), 3333-3347. https://doi.org/10.32604/cmc.2022.020197
Received 14 May 2021; Accepted 15 June 2021; Issue published 27 September 2021
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