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Numerical Analysis of the Effect of Diffusion and Creep Flow on Cavity Growth

J. Oh1, N. Katsube2, F.W. Brust3

Samsung Electronics Co., San #16 Banwol-Ri, Taean-Eup, Hwasung-City, Gyeonggi-Do, Korea, 445-701. joonyoung. Email: oh@samsung.com.
Mechanical Engineering, Ohio State University, 650 Ackerman rd., Columbus, Ohio, 43202. Tel: 614-292-0971, E-mail: katsube.1@osu.edu.
Battelle Memorial Institute, 505 King Avenue, Columbus,Ohio 43201-2693. E-mail: brust@battelle.org.

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