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Numerical Analysis of the Effect of Diffusion and Creep Flow on Cavity Growth

J. Oh1, N. Katsube2, F.W. Brust3

Samsung Electronics Co., San #16 Banwol-Ri, Taean-Eup, Hwasung-City, Gyeonggi-Do, Korea, 445-701. joonyoung. Email: oh@samsung.com.
Mechanical Engineering, Ohio State University, 650 Ackerman rd., Columbus, Ohio, 43202. Tel: 614-292-0971, E-mail: katsube.1@osu.edu.
Battelle Memorial Institute, 505 King Avenue, Columbus,Ohio 43201-2693. E-mail: brust@battelle.org.

Computers, Materials & Continua 2007, 6(3), 129-158. https://doi.org/10.3970/cmc.2007.006.129

Abstract

In this paper, intergranular cavity growth in regimes, where both surface diffusion and deformation enhanced grain boundary diffusion are important, is studied. In order to continuously simulate the cavity shape evolution and cavity growth rate, a fully-coupled numerical method is proposed. Based on the fully-coupled numerical method, a gradual cavity shape change is predicted and this leads to the adverse effect on the cavity growth rate. As the portion of the cavity volume growth due to jacking and viscoplastic deformation in the total cavity volume growth increases, spherical cavity evolves to V-shaped cavity. The obtained numerical results are physically more realistic compared to results in the previous works. The present numerical results suggest that the cavity shape evolution and cavity growth rate based on the assumed cavity shape, spherical or crack-like, simply cannot be used in this regime.

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APA Style
Oh, J., Katsube, N., Brust, F. (2007). Numerical analysis of the effect of diffusion and creep flow on cavity growth. Computers, Materials & Continua, 6(3), 129-158. https://doi.org/10.3970/cmc.2007.006.129
Vancouver Style
Oh J, Katsube N, Brust F. Numerical analysis of the effect of diffusion and creep flow on cavity growth. Comput Mater Contin. 2007;6(3):129-158 https://doi.org/10.3970/cmc.2007.006.129
IEEE Style
J. Oh, N. Katsube, and F. Brust, “Numerical Analysis of the Effect of Diffusion and Creep Flow on Cavity Growth,” Comput. Mater. Contin., vol. 6, no. 3, pp. 129-158, 2007. https://doi.org/10.3970/cmc.2007.006.129



cc Copyright © 2007 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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