Table of Content

Open Access iconOpen Access

ARTICLE

A General Equation for Stress Concentration in Countersunk Holes

by Kunigal N. Shivakumar1, Anil Bhargava2, Sameer Hamoush3

Corresponding author. Tel.: 336-334-7411 x 2112; fax:336-256-0873. E-mail address: kunigal@ncat.edu. Department of Mechanical and Chemical Engineering, Center for Composite Materials Research, North Carolina A & T State University, Greensboro, NC 27411.
Infosys Technologies Limited, 6100 Tennyson Parkway Suite 200, Plano, TX 75024.
Department of Civil and Architectural Engineering, Center for Composite Materials Research, North Carolina A & T State University, Greensboro, NC 27411.

Computers, Materials & Continua 2007, 6(2), 71-92. https://doi.org/10.3970/cmc.2007.006.071

Abstract

A detailed and accurate three-dimensional finite element stress analysis was conducted on countersunk rivet holes in a plate subjected to tension loading. The analysis included a wide range of countersunk depths, plate thicknesses, countersunk angles and plate widths. The study confirmed some of the previous results, addressed their differences, provided many new results, and investigated countersunk angle and width effects. Using the detailed FE results and the limiting conditions, a general equation for stress concentration was developed and verified.

Keywords


Cite This Article

APA Style
Shivakumar, K.N., Bhargava, A., Hamoush, S. (2007). A general equation for stress concentration in countersunk holes. Computers, Materials & Continua, 6(2), 71-92. https://doi.org/10.3970/cmc.2007.006.071
Vancouver Style
Shivakumar KN, Bhargava A, Hamoush S. A general equation for stress concentration in countersunk holes. Comput Mater Contin. 2007;6(2):71-92 https://doi.org/10.3970/cmc.2007.006.071
IEEE Style
K. N. Shivakumar, A. Bhargava, and S. Hamoush, “A General Equation for Stress Concentration in Countersunk Holes,” Comput. Mater. Contin., vol. 6, no. 2, pp. 71-92, 2007. https://doi.org/10.3970/cmc.2007.006.071



cc Copyright © 2007 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
  • 2159

    View

  • 1557

    Download

  • 0

    Like

Related articles

Share Link