Open Access

ARTICLE

Evaluations of the BGA Solder Ball Shape by Using Energy Method

Heng Cheng Lin^1,2, Chieh Kung³, Rong Sheng Chen²

1 Corresponding author. E-mail: hclinh@gmail.com, Tel: +886-6-2426135. 2 Department of Engineering Science, National Cheng Kung University. 3 Department of Computer Application Engineering, Far East University.