Open Access
ARTICLE
Ayman Abdulhadi Althuwayb1, Fazirulhisyam Hashim2, Jiun Terng Liew2, Imran Khan3, Jeong Woo Lee4, Emmanuel Ampoma Affum5, Abdeldjalil Ouahabi6,7,*, Sébastien Jacques8
1 Department of Electrical Engineering, Jouf University, Sakaka, Aljouf, 72388, Kingdom of Saudi Arabia
2 Department of Computer and Communication Systems Engineering, Faculty of Engineering, Universiti Putra Malaysia (UPM), Serdang, 43400, Malaysia
3 Department of Electrical Engineering, University of Engineering and Technology Peshawar, Pakistan
4 School of Electrical and Electronics Engineering, Chung-Ang University, Seoul, 06974, Korea
5 Electrical and Electronic Department, Kwame Nkrumah University of Science and Technology, Kumasi, Ghana
6 UMR 1253, iBrain, Université de Tours, INSERM, Tours, France
7 LIMPAF Laboratory, Department of Computer Science, University of Bouira, Bouira, 10000, Algeria
8 University of Tours (France), GREMAN UMR 7347, CNRS, INSA Centre Val-de-Loire, Tours, 37100, France
* Corresponding Author: Abdeldjalil Ouahabi. Email:
Computers, Materials & Continua 2021, 69(1), 679-694. https://doi.org/10.32604/cmc.2021.015421
Received 20 November 2020; Accepted 30 December 2020; Issue published 04 June 2021
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