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Enhancement of Sentiment Analysis Using Clause and Discourse Connectives

by Kumari Sheeja Saraswathy, Sobha Lalitha Devi*

AU-KBC Research Centre, MIT Campus of Anna University, Chromepet, Chennai, India

* Corresponding Author: Sobha Lalitha Devi. Email: email

Computers, Materials & Continua 2021, 68(2), 1983-1999. https://doi.org/10.32604/cmc.2021.015661

Abstract

The sentiment of a text depends on the clausal structure of the sentence and the connectives’ discourse arguments. In this work, the clause boundary, discourse argument, and syntactic and semantic information of the sentence are used to assign the text’s sentiment. The clause boundaries identify the span of the text, and the discourse connectives identify the arguments. Since the lexicon-based analysis of traditional sentiment analysis gives the wrong sentiment of the sentence, a deeper-level semantic analysis is required for the correct analysis of sentiments. Hence, in this study, explicit connectives in Malayalam are considered to identify the discourse arguments. A supervised method, conditional random fields, is used to identify the clause boundary and discourse arguments. For the study, 1,000 sentiment sentences from Malayalam documents were analyzed. Experimental results show that the discourse structure integration considerably improves sentiment analysis performance from the baseline system.

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APA Style
Saraswathy, K.S., Devi, S.L. (2021). Enhancement of sentiment analysis using clause and discourse connectives. Computers, Materials & Continua, 68(2), 1983-1999. https://doi.org/10.32604/cmc.2021.015661
Vancouver Style
Saraswathy KS, Devi SL. Enhancement of sentiment analysis using clause and discourse connectives. Comput Mater Contin. 2021;68(2):1983-1999 https://doi.org/10.32604/cmc.2021.015661
IEEE Style
K. S. Saraswathy and S. L. Devi, “Enhancement of Sentiment Analysis Using Clause and Discourse Connectives,” Comput. Mater. Contin., vol. 68, no. 2, pp. 1983-1999, 2021. https://doi.org/10.32604/cmc.2021.015661



cc Copyright © 2021 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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