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Local Stress Field in Wafer Thinning Simulations with Phase Space Averaging

Miaocao Wang1, Yuhua Huang1, Jinming Li1, Ling Xu2, Fulong Zhu1,*

1 School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074, China
2 School of Microelectronics, Fudan University, Shanghai, 200433, China

* Corresponding Author: Fulong Zhu. Email: email

TSP_CMC_16372.pdf

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