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Down to Zero Size of VoIP Packet Payload

Mosleh M. Abualhaj*, Qusai Y. Shambour, Abdelrahman H. Hussein, Qasem M. Kharma

Faculty of Information Technology, Al-Ahliyya Amman University, Amman, Jordan

* Corresponding Author: Mosleh M. Abualhaj. Email: email

Computers, Materials & Continua 2021, 68(1), 1271-1283. https://doi.org/10.32604/cmc.2021.014928

Abstract

Voice over Internet Protocol (VoIP) is widely used by companies, schools, universities, and other institutions. However, VoIP faces many issues that slow down its propagation. An important issue is poor utilization of the VoIP service network bandwidth, which results from the large header of the VoIP packet. The objective of this study is to handle this poor utilization of the network bandwidth. Therefore, this study proposes a novel method to address this large header overhead problem. The proposed method is called zero size payload (ZSP), which aims to reemploy and use the header information (fields) of the VoIP packet that is dispensable to the VoIP service, particularly the unicast IP voice calls. In general, these fields are used to carry the VoIP packet payload. Therefore, the size of the payload is reduced to save bandwidth. The performance estimation results of the proposed ZSP method showed a considerable improvement in the bandwidth utilization of the VoIP service. For example, the saved bandwidth in the tested scenario with the G.723.1, G.729, and LPC codecs reached 32%, 28%, and 26% respectively.

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APA Style
Abualhaj, M.M., Shambour, Q.Y., Hussein, A.H., Kharma, Q.M. (2021). Down to zero size of voip packet payload. Computers, Materials & Continua, 68(1), 1271-1283. https://doi.org/10.32604/cmc.2021.014928
Vancouver Style
Abualhaj MM, Shambour QY, Hussein AH, Kharma QM. Down to zero size of voip packet payload. Comput Mater Contin. 2021;68(1):1271-1283 https://doi.org/10.32604/cmc.2021.014928
IEEE Style
M.M. Abualhaj, Q.Y. Shambour, A.H. Hussein, and Q.M. Kharma, “Down to Zero Size of VoIP Packet Payload,” Comput. Mater. Contin., vol. 68, no. 1, pp. 1271-1283, 2021. https://doi.org/10.32604/cmc.2021.014928

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cc Copyright © 2021 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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