Open Access
ARTICLE
Arun Kumar1, Mahmoud A. Albreem2, Mohammed H. Alsharif3, Abu Jahid4, Peerapong Uthansakul5,*, Jamel Nebhen6
1 Department of Electronics and Communication Engineering, JECRC University, Jaipur, 303905, India
2 Department of Electronics and Communications Engineering, A’Sharqiyah University, Ibra, 400, Oman
3 Department of Electrical Engineering, College of Electronics and Information Engineering, Sejong University, Gwangjin-gu, Seoul, 05006, Korea
4 Department of Electrical & Computer Engineering, University of Ottawa, Ottawa, ON K1N 6N5, Canada
5 School of Telecommunication Engineering, Suranaree University of Technology, Nakhon Ratchasima, Thailand
6 College of Computer Engineering and Sciences, Prince Sattam bin Abdulaziz University, Alkharj, 11942, Saudi Arabia
* Corresponding Author: Peerapong Uthansakul. Email:
Computers, Materials & Continua 2021, 67(3), 3283-3292. https://doi.org/10.32604/cmc.2021.015470
Received 23 November 2020; Accepted 11 January 2021; Issue published 01 March 2021
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