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ARTICLE
Anudeep Gandam1,*, Jagroop Singh Sidhu2
1 Department of Electronics and Communication Engineering, IKG-Punjab Technical University, Jalandhar, 144603, India
2 Department of Electronics and Communication Engineering, DAVIET, Jalandhar, India
* Corresponding Author: Anudeep Gandam. Email:
Computers, Materials & Continua 2021, 66(3), 3045-3063. https://doi.org/10.32604/cmc.2021.013663
Received 16 August 2020; Accepted 17 October 2020; Issue published 28 December 2020
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