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Experimental Investigation on the Performance of Heat Pump Operating with Copper and Alumina Nanofluids

Faizan Ahmed*, Waqar Ahmed Khan, Jamal Nayfeh
Mechanical Engineering Department, College of Engineering, Prince Mohammad Bin Fahd University, Al Khobar, 31952, Saudi Arabia
* Corresponding Author: Faizan Ahmed. Email:

Computers, Materials & Continua 2021, 66(3), 2843-2856.

Received 11 June 2020; Accepted 03 July 2020; Issue published 28 December 2020


In the present study, an attempt is made to enhance the performance of heat pump by utilizing two types of nanofluids namely, copper and alumina nanofluids. These nanofluids were employed around the evaporator coil of the heat pump. The nanofluids were used to enhance the heat input to the system by means of providing an external jacket around the evaporator coil. Both the nanofluids were prepared in three volume fractions 1%, 2% and 5%. Water was chosen as the base fluid. The performance of the heat pump was assessed by calculating the coefficient of performance of the system when it was operated with and without nanofluid jacket. A significant enhancement in the coefficient of performance was noticed when copper and alumina nanofluids were employed in the system. Also, the coefficient of performance was found to have a direct relationship with the tested volume fractions. For the highest volume fraction of 5%, the performance of the heat pump was found to enhance by 23% with alumina nanofluid, while for copper nanofluid, a very significant enhancement in performance by 72% was observed. Thus, utilizing of nanofluids in heat pumps can be very beneficial towards performance enhancement and the idea can also be extended to other thermal systems such as steam power plant, automobile radiator, industrial heat exchangers and refrigeration systems.


Nanoparticles; copper nanofluid; alumina nanofluid; heat pump; coefficient of performance

Cite This Article

F. Ahmed, W. Ahmed Khan and J. Nayfeh, "Experimental investigation on the performance of heat pump operating with copper and alumina nanofluids," Computers, Materials & Continua, vol. 66, no.3, pp. 2843–2856, 2021.


This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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