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A Sentinel-Based Peer Assessment Mechanism for Collaborative Learning

by Cong Wang, Mingming Zhao, Qinyue Wang, Min Li

1 Sichuan Police College, Luzhou, 646000, China.
2 Sichuan Normal University, Chengdu, 610068, China.
3 University of Tasmania, Sandy Bay, TAS, 7001, Australia.

* Corresponding Author: Min Li. Email: email.

Computers, Materials & Continua 2020, 65(3), 2309-2319. https://doi.org/10.32604/cmc.2020.09958

Abstract

This paper introduces a novel mechanism to improve the performance of peer assessment for collaborative learning. Firstly, a small set of assignments which have being pre-scored by the teacher impartially, are introduced as “sentinels”. The reliability of a reviewer can be estimated by the deviation between the sentinels’ scores judged by the reviewers and the impartial scores. Through filtering the inferior reviewers by the reliability, each score can then be subjected into mean value correction and standard deviation correction processes sequentially. Then the optimized mutual score which mitigated the influence of the subjective differences of the reviewers are obtained. We perform our experiments on 200 learners. They are asked to submit their assignments and review each other. In the experiments, the sentinel-based mechanism is compared with several other baseline algorithms. It proves that the proposed mechanism can effectively improve the accuracy of peer assessment, and promote the development of collaborative learning.

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APA Style
Wang, C., Zhao, M., Wang, Q., Li, M. (2020). A sentinel-based peer assessment mechanism for collaborative learning. Computers, Materials & Continua, 65(3), 2309-2319. https://doi.org/10.32604/cmc.2020.09958
Vancouver Style
Wang C, Zhao M, Wang Q, Li M. A sentinel-based peer assessment mechanism for collaborative learning. Comput Mater Contin. 2020;65(3):2309-2319 https://doi.org/10.32604/cmc.2020.09958
IEEE Style
C. Wang, M. Zhao, Q. Wang, and M. Li, “A Sentinel-Based Peer Assessment Mechanism for Collaborative Learning,” Comput. Mater. Contin., vol. 65, no. 3, pp. 2309-2319, 2020. https://doi.org/10.32604/cmc.2020.09958



cc Copyright © 2020 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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