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A Novel Design of Mechanical Switch for the High Overload Environment

Yu Wang1, Chen Liu1, Lei Wang2, Lihua Zhu1, *

1 School of Mechanical Engineering, Nanjing University of Science and Technology, Nanjing, 210094, China.
2 School of Computing and Information Technology, University of Wollongong, Wollongong, NSW 2522, Australia.

* Corresponding Author: Lihua Zhu. Email: email.

Computers, Materials & Continua 2020, 65(1), 419-432. https://doi.org/10.32604/cmc.2020.010911

Abstract

The internal structure of the inertial measurement unit (IMU) in active state is easily damaged in the high overload environment. So that the IMU is usually required to be powered within the disappearance of the high overload. In this paper, a mechanical switch is designed to enable the IMU based on the analysis of the impact of high overload on the power-supply circuit. In which, parameters of mechanical switch are determined through theoretical calculation and data analysis. The innovation of the proposed structure lies in that the mechanical switch is triggered through the high overload process and could provide a delay signal for the circuit. After all, the proposed switch is tested through mechanical simulation, impact test and practical test. The experimental results show that the designed mechanical switch can effectively and reliably provide the delay for the circuit and guarantee operation of the IMU under high overload.

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APA Style
Wang, Y., Liu, C., Wang, L., Zhu, L. (2020). A novel design of mechanical switch for the high overload environment. Computers, Materials & Continua, 65(1), 419-432. https://doi.org/10.32604/cmc.2020.010911
Vancouver Style
Wang Y, Liu C, Wang L, Zhu L. A novel design of mechanical switch for the high overload environment. Comput Mater Contin. 2020;65(1):419-432 https://doi.org/10.32604/cmc.2020.010911
IEEE Style
Y. Wang, C. Liu, L. Wang, and L. Zhu, “A Novel Design of Mechanical Switch for the High Overload Environment,” Comput. Mater. Contin., vol. 65, no. 1, pp. 419-432, 2020. https://doi.org/10.32604/cmc.2020.010911



cc Copyright © 2020 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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