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Multiscale Analysis of the Effect of Debris on Fretting Wear Process Using a Semi-Concurrent Method

Shengjie Wang1, Tongyan Yue2, Magd Abdel Wahab3, 4, *

1 Soete Laboratory, Faculty of Engineering and Architecture, Ghent University, Technologiepark Zwijnaarde 903, Zwijnaarde B-9052, Belgium.
2 State Grid Xinyuan Maintenance Branch, Beijing, China.
3 Division of Computational Mechanics, Ton Duc Thang University, Ho Chi Minh City, Vietnam.
4 Faculty of Civil Engineering, Ton Duc Thang University, Ho Chi Minh City, Vietnam.

* Corresponding Author: Magd Abdel Wahab. Email: email.

Computers, Materials & Continua 2020, 62(1), 17-35. https://doi.org/10.32604/cmc.2020.07790

Abstract

Fretting wear is a phenomenon, in which wear happens between two oscillatory moving contact surfaces in microscale amplitude. In this paper, the effect of debris between pad and specimen is analyzed by using a semi-concurrent multiscale method. Firstly, the macroscale fretting wear model is performed. Secondly, the part with the wear profile is imported from the macroscale model to a microscale model after running in stage. Thirdly, an effective pad’s radius is extracted by analyzing the contact pressure in order to take into account the effect of the debris. Finally, the effective radius is up-scaled from the microscale model to the macroscale model, which is used after running in stage. In this way, the effect of debris is considered by changing the radius of the pad in the macroscale model. Due to the smaller number of elements in the microscale model compared with the macroscale model containing the debris layer, the semi-concurrent method proposed in this paper is more computationally efficient. Moreover, the results of this semi-concurrent method show a better agreement with experimental data, compared to the results of the model ignoring the effect of debris.

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Cite This Article

S. Wang, T. Yue and M. Abdel Wahab, "Multiscale analysis of the effect of debris on fretting wear process using a semi-concurrent method," Computers, Materials & Continua, vol. 62, no.1, pp. 17–35, 2020.

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cc This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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