Open Access
ARTICLE
Multiscale Analysis of the Effect of Debris on Fretting Wear Process Using a Semi-Concurrent Method
Shengjie Wang1, Tongyan Yue2, Magd Abdel Wahab3, 4, *
1 Soete Laboratory, Faculty of Engineering and Architecture, Ghent University, Technologiepark Zwijnaarde
903, Zwijnaarde B-9052, Belgium.
2 State Grid Xinyuan Maintenance Branch, Beijing, China.
3 Division of Computational Mechanics, Ton Duc Thang University, Ho Chi Minh City, Vietnam.
4 Faculty of Civil Engineering, Ton Duc Thang University, Ho Chi Minh City, Vietnam.
* Corresponding Author: Magd Abdel Wahab. Email: .
Computers, Materials & Continua 2020, 62(1), 17-35. https://doi.org/10.32604/cmc.2020.07790
Abstract
Fretting wear is a phenomenon, in which wear happens between two
oscillatory moving contact surfaces in microscale amplitude. In this paper, the effect of
debris between pad and specimen is analyzed by using a semi-concurrent multiscale
method. Firstly, the macroscale fretting wear model is performed. Secondly, the part with
the wear profile is imported from the macroscale model to a microscale model after
running in stage. Thirdly, an effective pad’s radius is extracted by analyzing the contact
pressure in order to take into account the effect of the debris. Finally, the effective radius
is up-scaled from the microscale model to the macroscale model, which is used after
running in stage. In this way, the effect of debris is considered by changing the radius of
the pad in the macroscale model. Due to the smaller number of elements in the
microscale model compared with the macroscale model containing the debris layer, the
semi-concurrent method proposed in this paper is more computationally efficient.
Moreover, the results of this semi-concurrent method show a better agreement with
experimental data, compared to the results of the model ignoring the effect of debris.
Keywords
Cite This Article
S. Wang, T. Yue and M. Abdel Wahab, "Multiscale analysis of the effect of debris on fretting wear process using a semi-concurrent method,"
Computers, Materials & Continua, vol. 62, no.1, pp. 17–35, 2020.
Citations