Vol.58, No.3, 2019, pp.761-775, doi:10.32604/cmc.2019.04363
OPEN ACCESS
ARTICLE
A Straightforward Direct Traction Boundary Integral Method for Two-Dimensional Crack Problems Simulation of Linear Elastic Materials
  • Chao Zhang1, Chunhe Yang1, Shangwei Wu2,3, Xiaolong Zhang1,2, Wen Nie2,*
State Key Laboratory of Geomechanics and Geotechnical Engineering, Institute of Rock and Soil Mechanics, Chinese Academy of Sciences, Wuhan, 430071, China.
Quanzhou Institute of Equipment Manufacturing, Haixi Institutes, Chinese Academy of Sciences, Quanzhou, Fujian, 362000, China.
College of Safety Engineering, Chongqing University of Science and Technology, Chongqing, 401331, China.
* Corresponding Author: Wen Nie. Email: .
Abstract
This paper presents a direct traction boundary integral equation method (DTBIEM) for two-dimensional crack problems of materials. The traction boundary integral equation was collocated on both the external boundary and either side of the crack surfaces. The displacements and tractions were used as unknowns on the external boundary, while the relative crack opening displacement (RCOD) was chosen as unknowns on either side of crack surfaces to keep the single-domain merit. Only one side of the crack surfaces was concerned and needed to be discretized, thus the proposed method resulted in a smaller system of algebraic equations compared with the dual boundary element method (DBEM). A new set of crack-tip shape functions was constructed to represent the strain field singularity exactly, and the SIFs were evaluated by the extrapolation of the RCOD. Numerical examples for both straight and curved cracks are given to validate the accuracy and efficiency of the presented method.
Keywords
Fracture mechanics, direct traction integral method, relative crack opening displacement, stress intensity factor.
Cite This Article
C. . Zhang, C. . Yang, S. . Wu, X. . Zhang and W. . Nie, "A straightforward direct traction boundary integral method for two-dimensional crack problems simulation of linear elastic materials," Computers, Materials & Continua, vol. 58, no.3, pp. 761–775, 2019.
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