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Design of ECC based Secured Cloud Storage Mechanism for Transaction Rich Applications

V. Gopinath1, R. S. Bhuvaneswaran2

Sathyabama University, Department of Sciences and Humanities, Chennai, 600119, India.
Anna University, Department of Computer Science & Engineering, Chennai, 600025, India.

* Corresponding Author: V. Gopinath. E-mail: email.

Computers, Materials & Continua 2018, 57(2), 341-352. https://doi.org/10.32604/cmc.2018.04006

Abstract

Cloud computing is the highly demanded technology nowadays. Due to the service oriented architecture, seamless accessibility and other advantages of this advent technology, many transaction rich applications are making use of it. At the same time, it is vulnerable to hacks and threats. Hence securing this environment is of at most important and many research works are being reported focusing on it. This paper proposes a safe storage mechanism using Elliptic curve cryptography (ECC) for the Transaction Rich Applications (TRA). With ECC based security scheme, the security level of the protected system will be increased and it is more suitable to secure the delivered data in the portable devices. The proposed scheme shields the aligning of different kind of data elements to each provider using an ECC algorithm. Analysis, comparison and simulation prove that the proposed system is more effective and secure for the Transaction rich applications in Cloud.

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Cite This Article

APA Style
Gopinath, V., Bhuvaneswaran, R.S. (2018). Design of ECC based secured cloud storage mechanism for transaction rich applications. Computers, Materials & Continua, 57(2), 341-352. https://doi.org/10.32604/cmc.2018.04006
Vancouver Style
Gopinath V, Bhuvaneswaran RS. Design of ECC based secured cloud storage mechanism for transaction rich applications. Comput Mater Contin. 2018;57(2):341-352 https://doi.org/10.32604/cmc.2018.04006
IEEE Style
V. Gopinath and R.S. Bhuvaneswaran, “Design of ECC based Secured Cloud Storage Mechanism for Transaction Rich Applications,” Comput. Mater. Contin., vol. 57, no. 2, pp. 341-352, 2018. https://doi.org/10.32604/cmc.2018.04006

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cc Copyright © 2018 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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