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A Dual-spline Approach to Load Error Repair in a HEMS Sensor Network

by Xiaodong Liu1, Qi Liu1

School of Computing, Edinburgh Napier University, 10 Colinton Road, Edinburgh EH10 5DT, UK.

* Corresponding Author: Qi Liu. Email: email.

Computers, Materials & Continua 2018, 57(2), 179-194. https://doi.org/10.32604/cmc.2018.04025

Abstract

In a home energy management system (HEMS), appliances are becoming diversified and intelligent, so that certain simple maintenance work can be completed by appliances themselves. During the measurement, collection and transmission of electricity load data in a HEMS sensor network, however, problems can be caused on the data due to faulty sensing processes and/or lost links, etc. In order to ensure the quality of retrieved load data, different solutions have been presented, but suffered from low recognition rates and high complexity. In this paper, a validation and repair method is presented to detect potential failures and errors in a domestic energy management system, which can then recover determined load errors and losses. A Kernel Extreme Learning Machine (K-ELM) based model has been employed with a Radial Basis Function (RBF) and optimised parameters for verification and recognition; whilst a Dual-spline method is presented to repair missing load data. According to the experiment results, the method outperforms the traditional B-spline and Cubic-spline methods and can effectively deal with unexpected data losses and errors under variant loss rates in a practical home environment.

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Cite This Article

APA Style
Liu, X., Liu, Q. (2018). A dual-spline approach to load error repair in a HEMS sensor network. Computers, Materials & Continua, 57(2), 179-194. https://doi.org/10.32604/cmc.2018.04025
Vancouver Style
Liu X, Liu Q. A dual-spline approach to load error repair in a HEMS sensor network. Comput Mater Contin. 2018;57(2):179-194 https://doi.org/10.32604/cmc.2018.04025
IEEE Style
X. Liu and Q. Liu, “A Dual-spline Approach to Load Error Repair in a HEMS Sensor Network,” Comput. Mater. Contin., vol. 57, no. 2, pp. 179-194, 2018. https://doi.org/10.32604/cmc.2018.04025



cc Copyright © 2018 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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