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Investigation in the Effects of Configuration Parameters on the Thermal Behavior of Novel Conical Friction Plate in Continuously Sliding Condition

by Yanzhong Wang1, Xiangyu Wu1

School of Mechanical Engineering, Beihang University, 37 Xueyuan Road, Haidian District, Beijing, 100191, China.

* Corresponding Author: Xiangyu Wu. Email: email.

Computers, Materials & Continua 2018, 56(3), 353-363. https://doi.org/10.3970/cmc.2018.03714

Abstract

To investigate the effects of configuration parameters and operation condition on the thermal behavior of novel conical friction plate, a three-dimensional finite element model of conical friction plate is established for numerical simulation. The conical surface configuration and friction heat generation of novel conical friction surfaces are discussed. The results indicate that the thermal behavior of the conical friction plate during continuously sliding period is influenced by the conical surface configuration. Maximum temperature occurs in the conical friction plate with cone angle of 24°. The maximum temperature value of friction plate is increased 7.4°C, when cone depth increases from 3 mm to 4 mm. Thermal behavior investigation should be carried out when optimize conical surface configuration

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APA Style
Wang, Y., Wu, X. (2018). Investigation in the effects of configuration parameters on the thermal behavior of novel conical friction plate in continuously sliding condition. Computers, Materials & Continua, 56(3), 353-363. https://doi.org/10.3970/cmc.2018.03714
Vancouver Style
Wang Y, Wu X. Investigation in the effects of configuration parameters on the thermal behavior of novel conical friction plate in continuously sliding condition. Comput Mater Contin. 2018;56(3):353-363 https://doi.org/10.3970/cmc.2018.03714
IEEE Style
Y. Wang and X. Wu, “Investigation in the Effects of Configuration Parameters on the Thermal Behavior of Novel Conical Friction Plate in Continuously Sliding Condition,” Comput. Mater. Contin., vol. 56, no. 3, pp. 353-363, 2018. https://doi.org/10.3970/cmc.2018.03714



cc Copyright © 2018 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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