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Wrinkling Analysis in a Film Bonded to a Compressible Compliant Substrate in Large Deformation

Zhicheng Ou1, Xiaohu Yao1, Xiaoqing Zhang1,2, Xuejun Fan3

School of Civil Engineering and Transportation, South China University of Technology,Guangzhou 510640, PR China.
Corresponding author. E-mail: tcqzhang@scut.edu.cn
Department of Mechanical Engineering, Lamar University, Beaumont, TX, 77710, USA.

Computers, Materials & Continua 2014, 44(3), 205-222. https://doi.org/10.3970/cmc.2014.044.205

Abstract

The buckling of a thin film on a compressible compliant substrate in large deformation is studied. A finite-deformation theory is developed to model the film and the substrate under different original strain-free configurations. The neo-Hookean constitutive relation is applied to describe the substrate. Through the perturbation analysis, the analytical solution for this highly nonlinear system is obtained. The buckling wave number, amplitude and critical condition are obtained. Comparing with the traditional linear model, the buckling amplitude decreases. The wave number increases and relates to the prestrain. With the increment of Poisson’s ratio of the substrate, the buckling wave number increases, but the amplitude decreases. The displacements near the interface are different in two models.

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APA Style
Ou, Z., Yao, X., Zhang, X., Fan, X. (2014). Wrinkling analysis in a film bonded to a compressible compliant substrate in large deformation. Computers, Materials & Continua, 44(3), 205-222. https://doi.org/10.3970/cmc.2014.044.205
Vancouver Style
Ou Z, Yao X, Zhang X, Fan X. Wrinkling analysis in a film bonded to a compressible compliant substrate in large deformation. Comput Mater Contin. 2014;44(3):205-222 https://doi.org/10.3970/cmc.2014.044.205
IEEE Style
Z. Ou, X. Yao, X. Zhang, and X. Fan, “Wrinkling Analysis in a Film Bonded to a Compressible Compliant Substrate in Large Deformation,” Comput. Mater. Contin., vol. 44, no. 3, pp. 205-222, 2014. https://doi.org/10.3970/cmc.2014.044.205



cc Copyright © 2014 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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