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Effect of Gravitational Field and Temperature Dependent Properties on Two-Temperature Thermoelastic Medium with Voids under G-N Theory

Mohamed I. A. Othman1, Magda E. M. Zidan1, Mohamed I. M. Hilal1

Department of Mathematics, Faculty of Science, P.O. Box 44519, Zagazig University, Zagazig, Egypt. Email: m_i_a_othman@yahoo.com; magdazidan66@yahoo.com; mimhilal@yahoo.com

Computers, Materials & Continua 2014, 40(3), 179-201. https://doi.org/10.3970/cmc.2014.040.179

Abstract

This investigation is aimed to study the two dimensional problem of thermoelastic medium with voids under the effect of the gravity. The modulus of elasticity is taken as a linear function of the reference temperature and employing the two-temperature generalized thermoelasticity. The problem is studied in the context of Green-Naghdi (G-N) theory of types II and III. The normal mode analysis method is used to obtain the exact expressions for the physical quantities which have been shown graphically by comparison between two types of the (G-N) theory in the presence and the absence of the gravity, the temperature dependent properties and the two-temperature effect.

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APA Style
Othman, M.I.A., Zidan, M.E.M., Hilal, M.I.M. (2014). Effect of gravitational field and temperature dependent properties on two-temperature thermoelastic medium with voids under G-N theory. Computers, Materials & Continua, 40(3), 179-201. https://doi.org/10.3970/cmc.2014.040.179
Vancouver Style
Othman MIA, Zidan MEM, Hilal MIM. Effect of gravitational field and temperature dependent properties on two-temperature thermoelastic medium with voids under G-N theory. Comput Mater Contin. 2014;40(3):179-201 https://doi.org/10.3970/cmc.2014.040.179
IEEE Style
M.I.A. Othman, M.E.M. Zidan, and M.I.M. Hilal, “Effect of Gravitational Field and Temperature Dependent Properties on Two-Temperature Thermoelastic Medium with Voids under G-N Theory,” Comput. Mater. Contin., vol. 40, no. 3, pp. 179-201, 2014. https://doi.org/10.3970/cmc.2014.040.179



cc Copyright © 2014 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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