Open Access iconOpen Access

ARTICLE

Optimization of Johnson-Cook Constitutive Model for Lead-free Solder Using Genetic Algorithm and Finite Element Simulations

D.S.Liu1, C.L.Hsu1,2

Advanced Institute of Manufacturing for High-tech Innovations and Department of Mechanical Engineering, National Chung Cheng University, Chia-yi County, Taiwan, R.O.C.
Corresponding author. Tel.: +886-5-2720411 (Ext: 23347); fax: +886-5-2720589; Email: changlin0331@gmail.com

TSP_CMC_165.pdf

  • 1880

    View

  • 1306

    Download

  • 0

    Like

Share Link