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Surface/interface Energy Effect on Electromechanical Responses Around a Nanosized Elliptical Inclusion under Far-field Loading at an Arbitrary Angle

by Xue-Qian Fang1, Hong-Wei Liu1, Yong-Mao Zhao1, Guo-Quan Nie1

Department of Engineering Mechanics, Shijiazhuang Tiedao University, Shijiazhuang, 050043, P.R. China.
Corresponding author. Tel.: +86 311 87935514; Email: stduxfang@yeah.net

Computers, Materials & Continua 2014, 40(2), 145-164. https://doi.org/10.3970/cmc.2014.040.145

Abstract

Electro-elastic surface/interface around nano-sized piezoelectric inclusions shows great effect on the response of piezoelectric nano-structures. In this paper, a theoretical model is proposed to examine the surface/interface effect on the electromechanical responses around a nano-sized elliptical piezoelectric inclusion embedded in an infinite piezoelectric matrix under far-field loading with an arbitrary angle, and the effect of loading angle is considered Combining the conformal mapping technique and electro-elastic surface/interface theory, a closed form solution of this problem is obtained and the interactive effect between the surface/interface and the aspect ratio of the elliptical inclusion is examined.

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APA Style
Fang, X., Liu, H., Zhao, Y., Liu, G.N.A.J. (2014). Surface/interface energy effect on electromechanical responses around a nanosized elliptical inclusion under far-field loading at an arbitrary angle. Computers, Materials & Continua, 40(2), 145-164. https://doi.org/10.3970/cmc.2014.040.145
Vancouver Style
Fang X, Liu H, Zhao Y, Liu GNAJ. Surface/interface energy effect on electromechanical responses around a nanosized elliptical inclusion under far-field loading at an arbitrary angle. Comput Mater Contin. 2014;40(2):145-164 https://doi.org/10.3970/cmc.2014.040.145
IEEE Style
X. Fang, H. Liu, Y. Zhao, and G.N.A.J. Liu, “Surface/interface Energy Effect on Electromechanical Responses Around a Nanosized Elliptical Inclusion under Far-field Loading at an Arbitrary Angle,” Comput. Mater. Contin., vol. 40, no. 2, pp. 145-164, 2014. https://doi.org/10.3970/cmc.2014.040.145



cc Copyright © 2014 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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