Open Access

ARTICLE

An Optimization Analysis of UBM Thicknesses and Solder Geometry on A Wafer Level Chip Scale Package Using Robust Methods

Heng-Cheng Lin¹, Chieh Kung², Rong-Sheng Chen¹, Gin-Tiao Liang¹

1 Department of Engineering Science, National Cheng Kung University, Tainan, Taiwan.
2 Department of Computer Application Engineering, Far East College, Tainan, Taiwan.