%0 Journal Article %A Lin, Heng-Cheng %A Kung, Chieh %A Chen, Rong-Sheng %A Liang, Gin-Tiao %D 2006 %J Computers, Materials \& Continua %@ 1546-2226 %V 3 %N 2 %P 55--64 %T An Optimization Analysis of UBM Thicknesses and Solder Geometry on A Wafer Level Chip Scale Package Using Robust Methods %M doi:10.3970/cmc.2006.003.055 %U http://www.techscience.com/cmc/v3n2/22375