Open Access

ARTICLE

Process-dependent Thermal-Mechanical Behaviors of an Advanced Thin-Flip-Chip-on-Flex Interconnect Technology with Anisotropic Conductive Film Joints

Hsien-Chie Cheng^1,2, Chien-Hao Ma¹, Ching-Feng Yu³, Su-Tsai Lu⁴, Wen-Hwa Chen^2,3

1 Department of Aerospace and Systems Engineering, Feng Chia University, Taichung, Taiwan, ROC.
2 Corresponding author.
3 Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan, ROC.
4 Electronics and Optoelectronics Research Laboratories, ITRI, Hsinchu, Taiwan, ROC.