Open Access

ARTICLE

Thermal-Cyclic Fatigue Life Analysis and Reliability Estimation of a FCCSP based on Probabilistic Design Concept

by Yao Hsu¹, Chih-Yen Su², Wen-Fang Wu³

1 Department of Business and Entrepreneurial Management, Kainan University, Taoyuan 33857, Taiwan, R.O.C.
2 Department of Mechanical Engineering, National Taiwan University, Taipei 10617, Taiwan, R.O.C.
3 Department of Mechanical Engineering and Graduate Institute of Industrial Engineering, National Taiwan University, Taipei 10617, Taiwan, R.O.C.
4 Corresponding author, Tel.: +886-2-33662727. E-mail address: wfwu@ntu.edu.tw

Computers, Materials & Continua 2013, 36(2), 155-176. https://doi.org/10.3970/cmc.2013.036.155

Abstract

To study the fatigue reliability of a flip-chip chip scale package (FCCSP) subject to thermal cyclic loading, a Monte Carlo simulation-based parametric study is carried out in the present study. A refined procedure as compared with the recently released Probabilistic Design System (PDS) of ANSYS is proposed and employed in particular. The thermal-cyclic fatigue life of the package is discussed in detail since it is related directly to the reliability of the package. In consideration of the analytical procedure as well as real manufacturing processes, a few geometric dimensions and material properties of the package are assumed random. The empirical parameters used in the fatigue life prediction formula are also assumed random to account for their uncertainties. Numerical calculation is performed following the standard finite element analysis procedure. The result indicates that PDS can indeed be employed to find the cumulative thermal-cyclic fatigue life distribution of the electronic package owing to various uncertainties. The proposed refined design procedure can further improve the accuracy of the quantitative reliability estimation.

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Keywords

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