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Multiscale Fatigue Life Prediction for Composite Panels

Brett A. Bednarcyk1, Phillip W. Yarrington2, Steven M. Arnold3

NASA Glenn Research Center, Cleveland, OH, 44135
Collier Research Corp., Newport News, VA, 23606
NASA Glenn Research Center, Cleveland, OH, 44135

Computers, Materials & Continua 2013, 35(3), 229-254. https://doi.org/10.3970/cmc.2013.035.229

Abstract

Fatigue life prediction capabilities have been incorporated into the HyperSizer Composite Analysis and Structural Sizing Software. The fatigue damage model is introduced at the fiber/matrix constituent scale through HyperSizer’s coupling with NASA’s MAC/GMC micromechanics software. This enables prediction of the micro scale damage progression throughout stiffened and sandwich panels as a function of cycles leading ultimately to simulated panel failure. The fatigue model implementation uses a cycle jumping technique such that, rather than applying a specified number of additional cycles, a specified local damage increment is specified and the number of additional cycles to reach this damage increment is calculated. In this way, the effect of stress redistribution due to damage-induced stiffness change is captured, but the fatigue simulations remain computationally efficient. The model is compared to experimental fatigue life data for two composite facesheet/foam core sandwich panels, demonstrating very good agreement.

Cite This Article

APA Style
Bednarcyk, B.A., Yarrington, P.W., Arnold, S.M. (2013). Multiscale fatigue life prediction for composite panels. Computers, Materials & Continua, 35(3), 229-254. https://doi.org/10.3970/cmc.2013.035.229
Vancouver Style
Bednarcyk BA, Yarrington PW, Arnold SM. Multiscale fatigue life prediction for composite panels. Comput Mater Contin. 2013;35(3):229-254 https://doi.org/10.3970/cmc.2013.035.229
IEEE Style
B.A. Bednarcyk, P.W. Yarrington, and S.M. Arnold, “Multiscale Fatigue Life Prediction for Composite Panels,” Comput. Mater. Contin., vol. 35, no. 3, pp. 229-254, 2013. https://doi.org/10.3970/cmc.2013.035.229



cc Copyright © 2013 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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