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Prediction of Crack Location in Deep Drawing Processes Using Finite Element Simulation

S. K. Panthi1, Sanjeev Saxena2

Corresponding Author: S. K. Panthi. Email: sanjay_panthi@yahoo.co.in; Tel.:+91 755 2457244; fax: +91 755 2488323; Postal Address: Computer Simulation & Process Modeling, CSIR-Advanced Materials and Process Research Institute (AMPRI), Bhopal (MP) India-462064
CSIR-Advanced Materials and Process Research Institute (AMPRI), Bhopal (MP) India-462064

Computers, Materials & Continua 2012, 32(1), 15-28. https://doi.org/10.3970/cmc.2012.032.015

Abstract

Sheet metal forming process like deep drawing subjected to large irreversible deformation. It leads to high strain localization zones and then internal or superficial micro defects. The deformation behavior and crack initiation in cylindrical deep drawing of aluminum alloy are simulated by the elasto-plastic finite element simulation. A1100-O and A2024-T4 sheet material are used in the simulation. Material properties based on the tensile and plane strain test is used in the simulation. Six cases are simulated in this study with different blank diameter. The simulated results are compared with the experimental results in terms of the crack location and critical punch displacement. The comparison of simulated results with experimental results shows a good agreement.

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Cite This Article

APA Style
Panthi, S.K., Saxena, S. (2012). Prediction of crack location in deep drawing processes using finite element simulation. Computers, Materials & Continua, 32(1), 15-28. https://doi.org/10.3970/cmc.2012.032.015
Vancouver Style
Panthi SK, Saxena S. Prediction of crack location in deep drawing processes using finite element simulation. Comput Mater Contin. 2012;32(1):15-28 https://doi.org/10.3970/cmc.2012.032.015
IEEE Style
S.K. Panthi and S. Saxena, “Prediction of Crack Location in Deep Drawing Processes Using Finite Element Simulation,” Comput. Mater. Contin., vol. 32, no. 1, pp. 15-28, 2012. https://doi.org/10.3970/cmc.2012.032.015



cc Copyright © 2012 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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