Open Access

ARTICLE

Stability of Solder Bridging for Area Array Type Packaging

Wen-Hwa Chen^1,2, Shu-Ru Lin², Kuo-Ning Chiang^2,3

1 Corresponding author, whchen@pme.nthu.edu.tw
2 Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan 30013, Republic of China
3 knchiang@pme.nthu.edu.tw