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Numerical Analysis of Parameters in a Laminated Beam Model by Radial Basis Functions

by Y. C. Hon1, L. Ling2, K. M. Liew3

City University of Hong Kong, Hong Kong. The work described inthis paper was fully supported by a grant from the Research GrantsCouncil of the Hong Kong Special Administrative Region, China(Project No. CityU 1185/03E).
City University of Hong Kong, Hong Kong
Nanyang Technological University, Singapore

Computers, Materials & Continua 2005, 2(1), 39-50. https://doi.org/10.3970/cmc.2005.002.039

Abstract

In this paper we investigate a thermal driven Micro-Electrical-Mechanical system which was originally designed for inkjet printer to precisely deliver small ink droplets onto paper. In the model, a tiny free-ended beam of metal bends and projects ink onto paper. The model is solved by using the recently developed radial basis functions method. We establish the accuracy of the proposed approach by comparing the numerical results with reported experimental data. Numerical simulations indicate that a light (low composite mass) beam is more stable as it does not oscillate much. A soft (low rigidity) beam results in a higher rate of deflection, when compared to a high rigidity one. Effects caused by the values of physical parameters are also studied. Finally, we give a prediction on the optimal time for the second current pulse which results in maximum rate of second deflection of the beam.

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APA Style
Hon, Y.C., Ling, L., Liew, K.M. (2005). Numerical analysis of parameters in a laminated beam model by radial basis functions. Computers, Materials & Continua, 2(1), 39-50. https://doi.org/10.3970/cmc.2005.002.039
Vancouver Style
Hon YC, Ling L, Liew KM. Numerical analysis of parameters in a laminated beam model by radial basis functions. Comput Mater Contin. 2005;2(1):39-50 https://doi.org/10.3970/cmc.2005.002.039
IEEE Style
Y. C. Hon, L. Ling, and K. M. Liew, “Numerical Analysis of Parameters in a Laminated Beam Model by Radial Basis Functions,” Comput. Mater. Contin., vol. 2, no. 1, pp. 39-50, 2005. https://doi.org/10.3970/cmc.2005.002.039



cc Copyright © 2005 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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