Open Access

ARTICLE

Analysis on Simulation of Quasi-Steady Molecular Statics Nanocutting Model and Calculation of Temperature Rise During Orthogonal Cutting of Single-Crystal Copper

Zone-Ching Lin¹, Ying-Chih Hsu¹

1 Department of Mechanical Engineering, National Taiwan University of Science and Technology, Taipei, Taiwan.

Computers, Materials & Continua 2012, 27(2), 143-178. https://doi.org/10.32604/cmc.2012.027.143

Abstract

This paper uses quasi-steady molecular statics method to carry out simulation of nanoscale orthogonal cutting of single-crystal copper workpiece by the diamond tools with different edge shapes. Based on the simulation results, this paper analyzes the cutting force, equivalent stress and strain, and temperature field. For the three-dimensional quasi-steady molecular statics nanocutting model used by this paper, when the cutting tool moves on a workpiece, displacement of atoms is caused due to the effects of potential on each other. After a small distance that each atom moves is directly solved by the calculated trajectory of each atom, the concept of force balance is used. And Hooke-Jeeves direct search method is also used to solve the force balance equation, and obtain the new movement position. When chip formation and the size of cutting force during cutting are calculated, further analysis is made. After the position of an atom's deformation displacement is acquired, the shape function concept of finite element is employed to obtain the atomic-level equivalent strain. With the stress-strain curve obtained from experiment of the numerical tensile value of nanoscale copper film taken as the foundation, regression treatment is made, and then the flow stress-strain relational equation is acquired. The flow stress-strain curve is used to calculate the equivalent stress produced under equivalent strain of element. This paper further supposes that workpiece temperature is mainly produced from two heat sources: plastic deformation heat and friction heat. Thus, this paper uses the acquired equivalent stress and strain to calculate plastic deformation heat. Besides, this paper additionally develops a method to calculate the numerical value of friction heat produced by the workpiece atoms on the tool face and the numerical value of temperature rise of workpiece atoms on tool face. Finally, the temperature rise produced from the two heat sources is added up for calculation of temperature field of the cut single-crystal copper workpiece during nanoscale orthogonal cutting, and for making analysis.

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