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Effect of Electric Field on the Response of Clamped-FreeMagnetostrictive/Piezoelectric/Magnetostrictive Laminates

Kotaro Mori1, Fumio Narita1, Yasuhide Shindo1

1 Tohoku University , Sendai, Japan.

Computers, Materials & Continua 2011, 23(3), 187-200. https://doi.org/10.3970/cmc.2011.023.187

Abstract

This work deals with the response of clamped-free magnetostrictive/piezoelectric/magnetostrictive laminates under electric field both numerically and experimentally. The laminate is fabricated using two magnetostrictive Terfenol-D layers and a soft piezoelectric PZT layer. Easy axis of Terfenol-D layers is length direction, while the polarization of PZT layer is the thickness direction. The magnetostriction of the Terfenol-D layers bonded to the upper and lower surfaces of the PZT layer is first measured. Next, a nonlinear finite element analysis is employed to evaluate the second-order magnetoelastic constants in the Terfenol-D layers bonded to the PZT layer using measured data. The induced magnetic field and internal stresses for the laminates under electric field parallel to the poling are then calculated and discussed in detail. In addition, the induced magnetic field is measured, and test results are presented to validate the predictions.

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Cite This Article

APA Style
Mori, K., Narita, F., Shindo, Y. (2011). Effect of electric field on the response of clamped-freemagnetostrictive/piezoelectric/magnetostrictive laminates. Computers, Materials & Continua, 23(3), 187-200. https://doi.org/10.3970/cmc.2011.023.187
Vancouver Style
Mori K, Narita F, Shindo Y. Effect of electric field on the response of clamped-freemagnetostrictive/piezoelectric/magnetostrictive laminates. Comput Mater Contin. 2011;23(3):187-200 https://doi.org/10.3970/cmc.2011.023.187
IEEE Style
K. Mori, F. Narita, and Y. Shindo, “Effect of Electric Field on the Response of Clamped-FreeMagnetostrictive/Piezoelectric/Magnetostrictive Laminates,” Comput. Mater. Contin., vol. 23, no. 3, pp. 187-200, 2011. https://doi.org/10.3970/cmc.2011.023.187



cc Copyright © 2011 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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