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Molecular Dynamics Simulations of the Nanoindentation for Aluminum and Copper
Computers, Materials & Continua 2011, 23(1), 1-8. https://doi.org/10.3970/cmc.2011.023.001
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Atomistic simulations were performed to study the nanoindentation for two kinds of FCC metals, aluminum and copper. Due to the higher stacking faults in aluminum than in copper, two different deformation mechanisms were observed in our simulation under exactly the same simulation condition. Aluminum and copper also showed different mechanical properties in the unloading stage. The influence of stacking sequence along the loading direction on deformation mechanism was also investigated in this paper.Keywords
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APA Style
Tang, X., Guo, Y., Gao, Y. (2011). Molecular dynamics simulations of the nanoindentation for aluminum and copper. Computers, Materials & Continua, 23(1), 1-8. https://doi.org/10.3970/cmc.2011.023.001
Vancouver Style
Tang X, Guo Y, Gao Y. Molecular dynamics simulations of the nanoindentation for aluminum and copper. Comput Mater Contin. 2011;23(1):1-8 https://doi.org/10.3970/cmc.2011.023.001
IEEE Style
X. Tang, Y. Guo, and Y. Gao, “Molecular Dynamics Simulations of the Nanoindentation for Aluminum and Copper,” Comput. Mater. Contin., vol. 23, no. 1, pp. 1-8, 2011. https://doi.org/10.3970/cmc.2011.023.001
Copyright © 2011 The Author(s). Published by Tech Science Press.This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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