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Study on Shear Test of New Style Automotive Structural Adhesive using Digital Image Correlation Method

Bin Li1, Guo-biao Yang1, Qi-rong Zhu2, Fan Ni2

School of Aerospace Engineering and Applied Mechanics, Tongji University, Shanghai, China
Paradigm Center of Mechanics Laboratory of Ministry of Education, Tongji University, Shanghai,China

Computers, Materials & Continua 2011, 21(2), 107-118. https://doi.org/10.3970/cmc.2011.021.107

Abstract

In this paper, digital image correlation method (DICM) is employed to measure the shear behavior of the spot welding specimens and the ones using adhesive under quasi-static lap shear testing. The images of the specimens' surfaces are captured in real-time by CCD and corresponding computer system. DICM is subsequently used to obtained strain by correlating the images captured before and after deformation. Then, both force-displacement curves and stress-strain curves of the specimens including the cracking load are obtained. The results and analysis show that the mechanical properties of specimens using adhesive compared with the spot welding specimens have an obvious advantage. This paper provides some experimental basis for improving this new type of structural adhesive. In this experiment, the method of non-contact measurement was used to obtain the strain. It has greater significance.

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APA Style
Li, B., Yang, G., Zhu, Q., Ni, F. (2011). Study on shear test of new style automotive structural adhesive using digital image correlation method. Computers, Materials & Continua, 21(2), 107-118. https://doi.org/10.3970/cmc.2011.021.107
Vancouver Style
Li B, Yang G, Zhu Q, Ni F. Study on shear test of new style automotive structural adhesive using digital image correlation method. Comput Mater Contin. 2011;21(2):107-118 https://doi.org/10.3970/cmc.2011.021.107
IEEE Style
B. Li, G. Yang, Q. Zhu, and F. Ni, “Study on Shear Test of New Style Automotive Structural Adhesive using Digital Image Correlation Method,” Comput. Mater. Contin., vol. 21, no. 2, pp. 107-118, 2011. https://doi.org/10.3970/cmc.2011.021.107



cc Copyright © 2011 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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