Open Access iconOpen Access

ARTICLE

Simulation of Thin Film Delamination Under Thermal Loading

L. Chernin1, K.Y. Volokh1,2

Faculty of Civil and Environmental Engineering, Technion, Haifa 32000, Israel.

2 Corresponding author: K.Y. Volokh. Email: email

TSP_CMC_259.pdf

  • 3147

    View

  • 2853

    Download

  • 0

    Like

Share Link