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An Assumed Strain Triangular Solid Element for Efficient Analysis of Plates and Shells with Finite Rotation

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SNU, Seoul, Republic of Korea
University of Maryland, MA, U.S.A

Computers, Materials & Continua 2004, 1(2), 141-152. https://doi.org/10.3970/cmc.2004.001.141

Abstract

A simple triangular solid shell element formulation is developed for efficient analysis of plates and shells undergoing finite rotations. The kinematics of the present solid shell element formulation is purely vectorial with only three translational degrees of freedom per node. Accordingly, the kinematics of deformation is free of the limitation of small angle increments, and thus the formulation allows large load increments in the analysis of finite rotation. An assumed strain field is carefully selected to alleviate the locking effect without triggering undesirable spurious kinematic modes. In addition, the curved surface of shell structures is modeled with flat facet elements to obviate the membrane locking effect. Various numerical examples demonstrate the efficiency and accuracy of the present element formulation for the analysis of plates and shells undergoing finite rotation. The present formulation is attractive in that only three points are needed for numerical integration over an element.

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APA Style
Kim, J.H., Kim, Y.H., Lee, S.W. (2004). An assumed strain triangular solid element for efficient analysis of plates and shells with finite rotation. Computers, Materials & Continua, 1(2), 141-152. https://doi.org/10.3970/cmc.2004.001.141
Vancouver Style
Kim JH, Kim YH, Lee SW. An assumed strain triangular solid element for efficient analysis of plates and shells with finite rotation. Comput Mater Contin. 2004;1(2):141-152 https://doi.org/10.3970/cmc.2004.001.141
IEEE Style
J.H. Kim, Y.H. Kim, and S.W. Lee, “An Assumed Strain Triangular Solid Element for Efficient Analysis of Plates and Shells with Finite Rotation,” Comput. Mater. Contin., vol. 1, no. 2, pp. 141-152, 2004. https://doi.org/10.3970/cmc.2004.001.141



cc Copyright © 2004 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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