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Finite Element Simulations of Four-holes Indirect Extrusion Processes of Seamless Tube

Dyi-Cheng1, Syuan-Yi Syong1

Department of Industrial Education and Technology, National Changhua University of Education, Changhua 500, Taiwan, R.O.C.

Computers, Materials & Continua 2009, 13(3), 191-200. https://doi.org/10.3970/cmc.2009.013.191

Abstract

Finite element simulations are performed to investigate the plastic deformation behavior of Ti-6Al-4V titanium alloy during its indirect extrusion through a four-hole die. The simulations assume the die, mandrel and container to be rigid bodies and ignore the temperature change induced during the extrusion process. Under various extrusion conditions, the present numerical analysis investigates the effective stress and profile of product at the exit. The relative influences of the friction factors, the temperature of billet and the eccentricity of four-hole displacement are systematically examined. The simulations focus specifically on the effects of the friction factor, billet temperature and eccentricity ratio of the four-hole die on the maximum load and effective stress induced within the billet and the taper angle of the extruded tubes. The simulation results provide a useful insight into the optimal processing conditions for the four-hole indirect extrusion of seamless titanium alloy tubes.

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APA Style
Dyi-Cheng, , Syong, S. (2009). Finite element simulations of four-holes indirect extrusion processes of seamless tube. Computers, Materials & Continua, 13(3), 191-200. https://doi.org/10.3970/cmc.2009.013.191
Vancouver Style
Dyi-Cheng , Syong S. Finite element simulations of four-holes indirect extrusion processes of seamless tube. Comput Mater Contin. 2009;13(3):191-200 https://doi.org/10.3970/cmc.2009.013.191
IEEE Style
Dyi-Cheng and S. Syong, “Finite Element Simulations of Four-holes Indirect Extrusion Processes of Seamless Tube,” Comput. Mater. Contin., vol. 13, no. 3, pp. 191-200, 2009. https://doi.org/10.3970/cmc.2009.013.191



cc Copyright © 2009 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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