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Experimental and Numerical Study of Micro Deep Drawing of Copper Single Crystal

by XL Geng1, KS Zhang2, YQ Guo1, L Qin1

Department of Engineering Mechanics, Northwestern Polytechnical University, Xi’an 710072, China
College of Civil and Architectural Engineering, Guangxi University, Nanning 530004, China

Computers, Materials & Continua 2009, 13(1), 1-16. https://doi.org/10.3970/cmc.2009.013.001

Abstract

One of the problems in a micro-forming process is the grain size effect, which means the formed part consists of a single grain or several grains sometimes, so the material shows anisotropic or heterogeneous. Under these conditions, a conventional method, which based on the isotropic and homogeneous material hypothesis, is not suitable. In this paper, Experimental investigations into micro deep drawing of the copper single crystal were carried out and the pattern of the micro-cup and the drawing force were observed. Using crystal plasticity theory, a user material subroutine (VUMAT) was built and linked to ABAQUS, and the micro deep drawing was simulated according to the experimental configuration. The results show that earing occurs at mouth of the micro-cup. The profile, quantity, and location of ears depend on the crystalline orientation in the blank. The simulations are in good agreement with the experiments, which demonstrate that the crystal theory has the rationality and validity in micro-forming simulations.

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APA Style
Geng, X., Zhang, K., Guo, Y., Qin, L. (2009). Experimental and numerical study of micro deep drawing of copper single crystal. Computers, Materials & Continua, 13(1), 1-16. https://doi.org/10.3970/cmc.2009.013.001
Vancouver Style
Geng X, Zhang K, Guo Y, Qin L. Experimental and numerical study of micro deep drawing of copper single crystal. Comput Mater Contin. 2009;13(1):1-16 https://doi.org/10.3970/cmc.2009.013.001
IEEE Style
X. Geng, K. Zhang, Y. Guo, and L. Qin, “Experimental and Numerical Study of Micro Deep Drawing of Copper Single Crystal,” Comput. Mater. Contin., vol. 13, no. 1, pp. 1-16, 2009. https://doi.org/10.3970/cmc.2009.013.001



cc Copyright © 2009 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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