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Interfaces Between two Dissimilar Elastic Materials

Chyanbin Hwu1, T.L. Kuo, Y.C. Chen

Institute of Aeronautics and Astronautics, National Cheng Kung University, Tainan, Taiwan,R.O.C. Tel: 886-6-2757575 ext.63662; Fax: 886-6-2389940; E-mail: CHwu@mail.ncku.edu.tw

Computers, Materials & Continua 2009, 11(3), 165-184. https://doi.org/10.3970/cmc.2009.011.165

Abstract

In this paper the near tip solutions for interface corners written in terms of the stress intensity factors are presented in a unified expression. This single expression is applicable for any kinds of interface corners including corners and cracks in homogeneous materials as well as interface corners and interface cracks lying between two dissimilar materials, in which the materials can be any kinds of linear elastic anisotropic materials or piezoelectric materials. Through this unified expression of near tip solutions, the singular orders of stresses and their associated stress/electric intensity factors for different kinds of interface problems can be determined through the same formulae and solution techniques. This unified feature of solving interface problems is then implemented numerically through several different interface problems. Moreover, in order to improve the accuracy and efficiency of numerical computation, a special boundary element based upon the Green's function of bimaterials is introduced in this paper.

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Cite This Article

APA Style
Hwu, C., Kuo, T., Chen, Y. (2009). Interfaces between two dissimilar elastic materials. Computers, Materials & Continua, 11(3), 165-184. https://doi.org/10.3970/cmc.2009.011.165
Vancouver Style
Hwu C, Kuo T, Chen Y. Interfaces between two dissimilar elastic materials. Comput Mater Contin. 2009;11(3):165-184 https://doi.org/10.3970/cmc.2009.011.165
IEEE Style
C. Hwu, T. Kuo, and Y. Chen, “Interfaces Between two Dissimilar Elastic Materials,” Comput. Mater. Contin., vol. 11, no. 3, pp. 165-184, 2009. https://doi.org/10.3970/cmc.2009.011.165



cc Copyright © 2009 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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