Open Access
ARTICLE
Chao-Hsien Hsieh1, Qingqing Yang2,*, Dehong Kong2, Fengya Xu2, Hongmei Wang2
1 College of Engineering, Xi’an International University, Xi’an, 710077, China
2 School of Cyber Science and Engineering, Qufu Normal University, Qufu, 273165, China
* Corresponding Author: Qingqing Yang. Email:
Computers, Materials & Continua https://doi.org/10.32604/cmc.2024.058122
Received 04 September 2024; Accepted 24 October 2024; Published online 02 December 2024
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