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T01067* Series Fuel Pump Pulp Molded Package Dynamic Drop Simulation

W. Zhongliang1, C. Jiawen1, F. Li1, C. Yang1, Z. Hong1,2,*

1 School of Light Industry and Textile, Qiqihar University, Qiqihar, 161006, China
2 Engineering Research Center for Hemp and Product in Cold Region of Ministry of Education, Qiqihar 161006, Heilongjiang, China

* Corresponding Author: Z. Hong. Email: email

Journal of New Media 2022, 4(2), 107-116. https://doi.org/10.32604/jnm.2022.019753

Abstract

In this paper, combined with the actual situation encountered in the process of product transportation, the finite element analysis software ANSYS/LS-DYNA was used to simulate the dynamic drop process of the buffer packaging structure of T01067* series fuel pump, and the simulation results were analyzed, and a conclusion was drawn. According to the fuel pump weight calculation buffer material thickness, according to the product size and structure design of the pulp molded cushion structure, simulation of static cushioning performance, and dynamic drop simulation, for the subsequent structural optimization cost reduction to provide early warning [,]. Check the simulation production cost, reduce many times a large number of experiments and time, structure is ideal type prediction, find out the ideal optimization total, physical test, further optimization and improvement [].

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Cite This Article

APA Style
Zhongliang, W., Jiawen, C., Li, F., Yang, C., Hong, Z. (2022). T01067* series fuel pump pulp molded package dynamic drop simulation. Journal of New Media, 4(2), 107-116. https://doi.org/10.32604/jnm.2022.019753
Vancouver Style
Zhongliang W, Jiawen C, Li F, Yang C, Hong Z. T01067* series fuel pump pulp molded package dynamic drop simulation. J New Media . 2022;4(2):107-116 https://doi.org/10.32604/jnm.2022.019753
IEEE Style
W. Zhongliang, C. Jiawen, F. Li, C. Yang, and Z. Hong, “T01067* Series Fuel Pump Pulp Molded Package Dynamic Drop Simulation,” J. New Media , vol. 4, no. 2, pp. 107-116, 2022. https://doi.org/10.32604/jnm.2022.019753



cc Copyright © 2022 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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