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3D Transient Heat Transfer by Conduction and Convection across a 2D Medium using a Boundary Element Model

N. Simões1,2, A. Tadeu2

nasimoes@dec.uc.pt
Department of Civil Engineering, University of Coimbra, Pinhal de Marrocos, 3030-290 Coimbra, Portugal

Computer Modeling in Engineering & Sciences 2005, 9(3), 221-234. https://doi.org/10.3970/cmes.2005.009.221

Abstract

The use of the Boundary Element Method (BEM) to formulate the 3D transient heat transfer through cylindrical structures with irregular cross-sections, bounded by a homogeneous elastic medium, is described in this paper. In this formulation, both the conduction and the convection phenomena are modeled. This system can be subjected to heat emitted by either point or line sources located somewhere in the media. The solution is first obtained in the frequency domain for a wide range of frequencies and axial wavenumbers. Time domain responses are later calculated by means of (fast) inverse Fourier transforms into space-time. The appropriate fundamental solution (Green's functions) employed in this BEM model takes the convection phenomenon into account. The model is implemented and validated by comparing it with analytical solutions for a filled cylindrical circular ring core placed in an infinite medium and subjected to a heat line source.

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APA Style
Simões, N., Tadeu, A. (2005). 3D transient heat transfer by conduction and convection across a 2D medium using a boundary element model. Computer Modeling in Engineering & Sciences, 9(3), 221-234. https://doi.org/10.3970/cmes.2005.009.221
Vancouver Style
Simões N, Tadeu A. 3D transient heat transfer by conduction and convection across a 2D medium using a boundary element model. Comput Model Eng Sci. 2005;9(3):221-234 https://doi.org/10.3970/cmes.2005.009.221
IEEE Style
N. Simões and A. Tadeu, “3D Transient Heat Transfer by Conduction and Convection across a 2D Medium using a Boundary Element Model,” Comput. Model. Eng. Sci., vol. 9, no. 3, pp. 221-234, 2005. https://doi.org/10.3970/cmes.2005.009.221



cc Copyright © 2005 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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