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Simulations of Three-dimensional Thermal Residual Stress and Warpage in Injection Molding

Xuejuan Li1,2, Jie Ouyang2,3, Wen Zhou2

School of Science, Xi’an University of Architecture and Technology, Xi’an, 710055, PR China.
School of Science, Northwestern Polytechnical University, Xi’an, 710129, PR China, jieouyang@nwpu.edu.cn
Corresponding author. Email: jieouyang@nwpu.edu.cn

TSP_CMES_379.pdf

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