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Solutions of a Crack Interacting with Tri-Material Composite in Plane Elasticity

by C.K. Chao1, A. Wikarta2

National Taiwan University of Science and Technology (NTUST), Taipei, Taiwan, ROC.
Institute of Technology Sepuluh Nopember,Kampus ITS Keputih, Indonesia

Computer Modeling in Engineering & Sciences 2013, 93(3), 167-186. https://doi.org/10.3970/cmes.2013.093.167

Abstract

In this paper a crack interacting with tri-material composite under a remote uniform tensile load is solved in plane elasticity. An edge dislocation distribution along the prospective site of the crack together with the principle of superposition is used to model a crack. The resulting singular integral equation with logarithmic singular kernels for a line crack is then established. The singular integral equation is solved numerically by modeling a crack in place of several segments. Linear interpolation formulae with undetermined coefficients are applied to approximate the dislocation distribution along the elements, except at vicinity of crack tip where the dislocation distribution preserves a square-root singularity. Once the undetermined dislocation coefficients are solved, the mode-I and mode-II stress intensity factors can be obtained. Some numerical results are performed to show the effects of material property combinations and geometric parameters on the normalized mode-I and mode-II stress intensity factors.

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Cite This Article

APA Style
Chao, C., Wikarta, A. (2013). Solutions of a crack interacting with tri-material composite in plane elasticity. Computer Modeling in Engineering & Sciences, 93(3), 167-186. https://doi.org/10.3970/cmes.2013.093.167
Vancouver Style
Chao C, Wikarta A. Solutions of a crack interacting with tri-material composite in plane elasticity. Comput Model Eng Sci. 2013;93(3):167-186 https://doi.org/10.3970/cmes.2013.093.167
IEEE Style
C. Chao and A. Wikarta, “Solutions of a Crack Interacting with Tri-Material Composite in Plane Elasticity,” Comput. Model. Eng. Sci., vol. 93, no. 3, pp. 167-186, 2013. https://doi.org/10.3970/cmes.2013.093.167



cc Copyright © 2013 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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