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Characterization and modeling of the multiscale pore structures for porous materials

by X.F. Guan1, X. Liu2, J.Z. Cui3

Department of Mathematics, Tongji University, Shanghai 200092, China.
Department of Geotechnical Engineering, Tongji University, Shanghai 200092, China.
Corresponding Author, Email: xian.liu@tongji.edu.cn
Academy of Mathematics and System Science, Chinese Academy of Sciences, Beijing 100190, China.

Computer Modeling in Engineering & Sciences 2013, 91(6), 425-444. https://doi.org/10.3970/cmes.2013.091.425

Abstract

In this paper, a stochastic geometrical modeling method for reconstructing three dimensional multiscale pore structures of porous materials is presented. In this method, the pore structure in porous materials is represented by a random but spatially correlated pore-network, in which the results of the Mercury Intrusion Porosimetry (MIP) experiment are used as the basic input information. Beside that, based on the Monte Carlo techniques, an effective computer generation algorithm is developed, and the quantities to evaluate the properties of porous materials are defined and described. Furthermore, numerical implementations are conducted based on experimental data afterwards. This method can be used to generate multiscale pore structure models of a wide class of porous materials.

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APA Style
Guan, X., Liu, X., Cui, J. (2013). Characterization and modeling of the multiscale pore structures for porous materials. Computer Modeling in Engineering & Sciences, 91(6), 425-444. https://doi.org/10.3970/cmes.2013.091.425
Vancouver Style
Guan X, Liu X, Cui J. Characterization and modeling of the multiscale pore structures for porous materials. Comput Model Eng Sci. 2013;91(6):425-444 https://doi.org/10.3970/cmes.2013.091.425
IEEE Style
X. Guan, X. Liu, and J. Cui, “Characterization and modeling of the multiscale pore structures for porous materials,” Comput. Model. Eng. Sci., vol. 91, no. 6, pp. 425-444, 2013. https://doi.org/10.3970/cmes.2013.091.425



cc Copyright © 2013 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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