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Computational Modelling of Isotropic Multiplicative Growth

G. Himpel, E. Kuhl, A. Menzel, P. Steinmann1

Chair of Applied Mechanics, Department of Mechanical and Process Engineering, University of Kaiserslautern, Germany, http://mechanik.mv.uni-kl.de

Computer Modeling in Engineering & Sciences 2005, 8(2), 119-134. https://doi.org/10.3970/cmes.2005.008.119

Abstract

The changing mass of biomaterials can either be modelled at the constitutive level or at the kinematic level. This contribution attends on the description of growth at the kinematic level. The deformation gradient will be multiplicatively split into a growth part and an elastic part. Hence, in addition to the material and the spatial configuration, we consider an intermediate configuration or grown configuration without any elastic deformations. With such an ansatz at hand, contrary to the modelling of mass changes at the constitutive level, both a change in density and a change in volume can be modelled. The algorithmic realisation of this framework within a finite element setting constitutes the main contribution of this paper. To this end the key kinematic variable, i.e. the isotropic stretch ratio, is introduced as internal variable at the integration point level. The consistent linearisation of the stress update based on an implicit time integration scheme is developed. Basic features of the model are illustrated by means of representative numerical examples.

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APA Style
Himpel, G., Kuhl, E., Menzel, A., Steinmann, P. (2005). Computational modelling of isotropic multiplicative growth. Computer Modeling in Engineering & Sciences, 8(2), 119-134. https://doi.org/10.3970/cmes.2005.008.119
Vancouver Style
Himpel G, Kuhl E, Menzel A, Steinmann P. Computational modelling of isotropic multiplicative growth. Comput Model Eng Sci. 2005;8(2):119-134 https://doi.org/10.3970/cmes.2005.008.119
IEEE Style
G. Himpel, E. Kuhl, A. Menzel, and P. Steinmann, “Computational Modelling of Isotropic Multiplicative Growth,” Comput. Model. Eng. Sci., vol. 8, no. 2, pp. 119-134, 2005. https://doi.org/10.3970/cmes.2005.008.119



cc Copyright © 2005 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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