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A new free energy-based model of the kinematic hardening in large strain elastoplasticity

Igor Karšaj1, Carlo Sansour2, Jurica Sorić1

Faculty of Mechanical Engineering and Naval Architecture, University of Zagreb, I.Lučića 5, HR-10000 Zagreb, Croatia
The University of Adelaide, School of Mechanical Engineering, SA 5005, Australia

Computer Modeling in Engineering & Sciences 2005, 8(1), 45-60. https://doi.org/10.3970/cmes.2005.008.045

Abstract

In this paper, a free energy-based formulation incorporating the effect of kinematic hardening is proposed. The formulation is able to reproduce symmetric expressions for the back stress while incorporating the multiplicative decomposition of the deformation gradient. Kinematic hardening is combined with isotropic hardening where an associative flow rule and von Mises yield criterion are applied. An accurate and trivial wise objective integration algorithm employing the exponential map is developed. In order to ensure a high convergence rate in the global iteration approach, an algorithmic tangent operator is derived. The computational algorithm is implemented and applied to a shell finite element which allows the use of complete three-dimensional constitutive laws. Robustness and efficiency of the proposed algorithm are demonstrated by numerical examples.

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APA Style
Karšaj, I., Sansour, C., Sorić, J. (2005). A new free energy-based model of the kinematic hardening in large strain elastoplasticity. Computer Modeling in Engineering & Sciences, 8(1), 45-60. https://doi.org/10.3970/cmes.2005.008.045
Vancouver Style
Karšaj I, Sansour C, Sorić J. A new free energy-based model of the kinematic hardening in large strain elastoplasticity. Comput Model Eng Sci. 2005;8(1):45-60 https://doi.org/10.3970/cmes.2005.008.045
IEEE Style
I. Karšaj, C. Sansour, and J. Sorić, “A new free energy-based model of the kinematic hardening in large strain elastoplasticity,” Comput. Model. Eng. Sci., vol. 8, no. 1, pp. 45-60, 2005. https://doi.org/10.3970/cmes.2005.008.045



cc Copyright © 2005 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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