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A Silent Boundary Scheme with the Material Point Method for Dynamic Analyses

by Luming Shen1, Zhen Chen2

UMC, Columbia, MO, USA
UMC, Columbia, MO, USA;
Corresponding Author: chenzh@missouri.edu

Computer Modeling in Engineering & Sciences 2005, 7(3), 305-320. https://doi.org/10.3970/cmes.2005.007.305

Abstract

To simulate the dynamic responses involving different material phases in a finite computational domain without discretizing the whole problem domain, a silent boundary scheme is proposed within the framework of the material point method (MPM) that is an extension from Computational Fluid Dynamics to Computational Solid Dynamics. Because the MPM does not employ fixed mesh connectivity, a robust spatial discretization procedure in the moving domain of influence could be designed by applying viscous damping forces along the computational boundary. To establish a simple interface between the discretization procedures with and without fixed mesh connectivity, a boundary layer is introduced to implement the continuously distributed viscous damping forces along the moving computational boundary. To verify the proposed procedure, a parametric study is conducted with plane strain and oblique impact problems. The application to the model-based simulation of film delamination then demonstrates the potential of the proposed procedure in simulating the evolution of localized failure with different degrees of discontinuity under dynamic loading.

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Cite This Article

APA Style
Shen, L., Chen, Z. (2005). A silent boundary scheme with the material point method for dynamic analyses. Computer Modeling in Engineering & Sciences, 7(3), 305-320. https://doi.org/10.3970/cmes.2005.007.305
Vancouver Style
Shen L, Chen Z. A silent boundary scheme with the material point method for dynamic analyses. Comput Model Eng Sci. 2005;7(3):305-320 https://doi.org/10.3970/cmes.2005.007.305
IEEE Style
L. Shen and Z. Chen, “A Silent Boundary Scheme with the Material Point Method for Dynamic Analyses,” Comput. Model. Eng. Sci., vol. 7, no. 3, pp. 305-320, 2005. https://doi.org/10.3970/cmes.2005.007.305



cc Copyright © 2005 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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